Semiconductor
Manufacturing International Corporation (SMIC) today announced that it will extend its 45-nanometer bulk
complementary metal–oxide semiconductor (CMOS) technologies to 40nm and
55nm geometries.
These
new processes will complement SMIC’s existing offerings to better
support customer demand worldwide, including in the fast-growing China
market. Applications include multimedia products, graphics chips,
chipsets, and mobile devices such as handsets integrated with 3G/4G.
“Our
45nm technology has been implemented at SMIC’s 300mm facility in
Shanghai ahead of schedule and we look forward to a similar result at
these additional geometries,” said SMIC’s President and CEO, Dr.
Richard Chang. “These new offerings provide our current and new
customers a customized set of solutions to meet their diverse product
design-in needs.”
About SMIC
Semiconductor
Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981)
is one of the leading semiconductor foundries in the world and the
largest and most advanced foundry in Mainland China, providing
integrated circuit (IC) foundry and technology services at 0.35um to
45nm. Headquartered in Shanghai, China, SMIC has a 300mm wafer
fabrication facility (fab) and three 200mm wafer fabs in its Shanghai
mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer
fab in Tianjin, a 200mm fab under construction in Shenzhen, and an
in-house assembly and testing facility in Chengdu. SMIC also has
customer service and marketing offices in the U.S., Europe, and Japan,
and a representative office in Hong Kong. In addition, SMIC manages and
operates a 200mm wafer fab in Chengdu owned by Cension Semiconductor
Manufacturing Corporation and a 300mm wafer fab in Wuhan owned by Wuhan
Xinxin Semiconductor Manufacturing Corporation
