Toshiba Corp. and Toshiba America
Electronic Components, Inc. (TAEC), its subsidiary in the Americas,
today announced the launch of a 64 gigabyte(2) (GB) embedded NAND flash
memory module, the highest capacity yet achieved in the industry. The
chip is the flagship device in a line-up of six new embedded NAND flash
memory modules that offer full compliance with the latest e-MMC(TM)(3)
standard, and that are designed for application in a wide range of
digital consumer products, including Smartphones, mobile phones,
netbooks and digital video cameras. Samples of the 64GB module are
available from today, and mass production will start in the first
quarter of 2010.
The new 64GB embedded device
combines sixteen pieces of 32Gbit (equal to 4GB) NAND chips fabricated
with Toshiba’s cutting-edge 32nm process technology, and also
integrates a dedicated controller. Toshiba is the first company to
succeed in combining 16 pieces of 32Gbit NAND chips, and applied
advanced chip thinning and layering technologies to realize individual
chips that are only 30 micrometers thick. Full compliance with the
JEDEC/MMCA Version 4.4(V4.4) standard for embedded MultiMediaCards
supports standard interfacing and simplifies embedding in products,
reducing development burdens on product manufacturers.
Toshiba offers a comprehensive
line-up of single-package embedded NAND Flash memories in densities
ranging from 2GB to 64GB. All integrate a controller to manage basic
control functions for NAND applications, and are compatible with the
latest e-MMC(TM) standard and its new features, including defining multiple storage areas and enhanced security features.
Demand continues to grow for
embedded memories with a controller function that minimizes development
requirements and eases integration into system designs. Toshiba has
established itself as an innovator in this key area. The company was
first to announce a 32GB e-MMC(TM) compliant device, and is now reinforcing its leadership by being first to market with a 64GB generation module.
"The e-MMC(TM) interface has
become the most widely embraced embedded NAND solution with a built-in
controller to simplify integration into system designs. With the
addition of higher density, Ver 4.4 e-MMC(TM) compliant product
offered as single package solutions or as part of a multi-chip module
combined with DRAM, Toshiba can help designers reduce memory subsystem
space requirements," said Scott Beekman, business development manager,
mobile communications memory for TAEC.
Toshiba e-MMC(TM) Ver 4.4
devices are available in a standard configuration with the NAND flash
and built-in controller or in a multi-chip module (MCP) with DRAM or
other memory to reduce the memory subsystem requirement to one chip.
Toshiba MCPs offer multiple memory technologies such as NAND Flash, NOR
Flash, Pseudo SRAM (PSRAM), and low-power SDRAM in a single package to
simplify layout and save valuable board space in increasingly complex,
feature-rich cellular phones.
|Part Number||Cap.||Package||Sample Shipment||Mass Production||Production Scale|
3 million/ month
|Apr. 2010||2Q, 2010
- The JEDEC/MMCA V4.4
compliant interface handles essential functions, including writing
block management, error correction and driver software. It simplifies
system development, allowing manufacturers to minimize development
costs and speed up time to market for new and upgraded products.
wide product line-up supports capacities from 2 to 64GB. The
high-capacity 64GB embedded devices can record up to 1,070 hours of
music at a1 28Kbps bit rate, 8.3 hours of full spec high definition
video(4) and 19.2 hours of standard definition video.
- The 64GB
device stacks sixteen 32Gbit chips fabricated with leading-edge 32nm
process technology. Application of advanced chip thinning, layering and
wire bonding technologies allowed Toshiba to achieve individual chips
only 30 micrometers thick, and to layer and bond them in a small
package. The result is the highest density embedded NAND flash memory
module in the industry.
- The new chips support the advanced partitioning and security of e-MMC(TM)
V4.4. Multiple storage areas can be configured, including several
enhanced memory areas for system files or code, and a multi-level cell
(MLC) area for data storage. The new 64GB product is sealed in a small
FBGA package, which is 14mm x 18mm x 1.4mm and has a signal layout
compliant with JEDEC/MMCA V4.4.
* Available only for THGBM2G5D1FBAI9 and THGBM2G4D1FBAI8.