Soitec Supplying SOI Substrates to CSMC for Display and Other Applications

The Soitec Group, the world’s leading supplier of engineered substrates
for
the microelectronics industry, announced today that the company has
entered
into an agreement to supply silicon-on-insulator substrates to
CSMC
Technologies Corporation ("CSMC"), a leading pure-play specialty analog
foundry based in China. Soitec is sampling SOI
substrates for High Voltage and CMOS applications initially aimed at color plasma display panel driver integrated circuits and other mixed signal and analog
applications. The company is seeing high levels of interest and support
in
China for SOI projects.

SOI is a cost-optimized technology increasing device performance
and
reliability, while lowering power consumption. These advantages are an
excellent complement to consumer electronics markets, as well as
continued
expansion into worldwide markets for automotive, RF/wireless,
high-voltage,
power management, photonics, imaging, lighting and more.

"With this agreement, CSMC will use Soitec’s wafers on several
major SOI
projects for High Voltage and CMOS technology. We believe the
partnership
with Soitec will help us to provide a more cost-effective solution to
our
customers," said Filian Wu, VP of Analog Process Technology Development
Center.

"As the world’s leader in SOI substrates, we are very pleased to
collaborate with CSMC and will support their plans to ramp up SOI based
products," said Paul Boudre, Chief Operating Officer of the Soitec
Group. "Over the last two years, we have experienced a strong
acceleration of
interest in SOI substrates in China mainly by the
majority of the largest
local foundries and institutes. Today these development projects are
moving
to first production ramp up and we expect a significant growth of SOI
based
products in China in the coming years."

CSMC is a leading pure-play specialty analog foundry in China
providing
fabless design houses and integrated device manufacturers with a wide
range
of manufacturing services. The company manufactures ICs and power
discrete
processes at production technology nodes ranging from 0.13 micron to 0.5
micron. CSMC ICs and power devices are utilized in a broad range of end
market applications including consumer electronics, communications
devices,
personal computers and more.

Designers of chips for leading analog and mixed signal
applications are
increasingly choosing SOI in large part because it dielectrically
isolates
all the transistor devices from each other, thereby eliminating the
danger of
chip-killing "latch-up". It also minimizes current leakage, thereby
saving
energy at high operating temperatures. And, it enables very compact
design,
taking 40% less space than traditional pn-isolation technologies. For
digital
CMOS applications, SOI increases performance by up to 30% and decreases
power
consumption by up to 50%.

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