Gigabyte will Participate in SuperSpeed USB Developers Conference 2010

GIGABYTE TECHNOLOGY Co., Ltd, a leading manufacturer of motherboards, graphics cards and other computing hardware solutions today proudly announced that Henry Kao, Senior VP of Worldwide Sales and Marketing, will be one of the participants in the keynote speech at this year’s SuperSpeed USB Developers Conference to be held on the 1st and 2nd of April, 2010, in Taipei, Taiwan. GIGABYTE USB 3.0 motherboard shipments achieved the 1 million mark recently, confirming the motherboard maker’s market leadership with an estimated marketshare of 1/3 of all existing SuperSpeed USB platforms. Henry will address acceptance of SuperSpeed USB platforms by the market and also leading international media.

"GIGABYTE is excited to be at the forefront of the move to SuperSpeed USB, and we look forward to sharing what we’ve learned with other ‘SuperSpeeders’ at this year’s USB DevCon," commented Henry Kao, Senior Vice President, Motherboard Business Unit, GIGABYTE Technology Co. Ltd. "As the Windows 7 desktop PC upgrade cycle picks up steam there could not be a better time to introduce a USB 3.0 product and we are very satisfied with the positive response from our customers and media friends towards our SuperSpeed USB motherboards."

"The advancements offered by SuperSpeed USB technology are significant for consumers," stated Jeff Ravencraft, president and chairman, USB Implementers Forum. "The ability to quickly transfer the incredible amount of digital content consumers have in their daily lives is paramount to a positive computing experience. That is why we are excited to watch the incredible rate of adoption and industry support for SuperSpeed USB." GIGABYTE USB 3.0 motherboards have been available since October, 2009, and span the entire range of market segments and price points with an unequalled 25 models available globally. This is a tribute to the outstanding R&D, design and manufacturing capabilities that are the foundation of the GIGABYTE motherboard brand.

"SuperSpeed USB provides wonderful opportunities for innovation such as increasing the power from each USB 3.0 port, or re-routing the USB 3.0 controller chip directly to the CPU for that little bit of extra performance over designs that use an additional PCIe bridge chip," said Richard Chen, Vice President of R&D, Motherboard Business Unit, GIGABYTE Technology Co. Ltd. "It is this innovation that we believe is earning us accolades from leading global media and in the coming weeks and months we plan to launch some more exciting SuperSpeed USB applications and performance tweaks that we expect will be real crowd pleasers.", a popular global PC hardware review site, recently compared USB 3.0 motherboard implementations and had this to say about GIGABYTE’s design: "…Yet Gigabyte managed to edge out (the PCIe bridge chip design) in write performance by taking its 5.0 Gb/s pathway directly from the CPU, eliminating any middle parts… that could slow the interface down…" The full review is available here.


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