AMD today announced a strong lineup of motherboard products for AMD’s 2011 low-power mobile platform (code-named “Brazos”) and the AMD Embedded G-Series platform for embedded systems (code-named “eBrazos”), both based on the first AMD Fusion Accelerated Processing Units (APUs). The 2011 low-power mobile platforms feature the new 18-watt AMD E-Series APU (code-named “Zacate”) or the 9-watt AMD C-Series APU (code-named “Ontario”).
“AMD is ushering in a new era of personal computing, and our industry partners are ready to take advantage of the first ever AMD Fusion APU,” said Chris Cloran, Corp. VP and GM, Computing Solutions Group, Client Division, AMD. “By combining the processing of the CPU with the GPU on a single energy efficient chip, we believe their customers can take advantage of better price/performance, superior 1080p HD playback and small form factors for innovative designs.” Infrastructure PartnersNumerous motherboard designs based on the AMD E-Series APU are planned for retail channels and system builders from leading original design manufacturers (ODMs), including ASUS, GIGABYTE, MSI and SAPPHIRE. Additional motherboard designs based on the AMD Embedded G-Series platform for embedded systems are scheduled for Q1 2011 availability to enable the next generation of embedded computing devices from digital signage and medical imaging to casino gaming machines and point-of-sale kiosks.
“With the new AMD E-Series APU, we can provide our customers the cost-effective solutions they’re looking for to build PCs with unrivalled image quality,” said Joe Hsieh, Vice President of ASUS. “Our AMD E-Series APU-based motherboards redefine the low-power, small PC experience to go beyond basic Internet browsing for today’s digital lifestyle.” “GIGABYTE leverages the latest processor platform technologies to address the needs of today’s demanding PC users,” said Henry Kao, Senior VP of Global Sales and Marketing at GIGABYTE Technology Co. Ltd. “Whether our customers are looking for a low-power small form factor solution or a system capable of delivering blazingly fast performance, our latest motherboards based on the dual-core AMD E-Series APU are ready and capable of addressing their needs.” “MSI has developed several new Mini-ITX and uATX motherboards designed to unleash the power of AMD’s E-Series APU for superior multimedia performance,” said Scott Yang, Vice President of Motherboard Sales & Marketing Business Unit, MSI. “Our latest motherboards featuring the AMD E-Series APU are designed for long-term use in small, quiet PCs ranging from silent Mini-ITX desktops to home digital media.” “It is clear that AMD Fusion technology is an important step forward in PC technology, and we’re looking forward to supplying our customers the latest motherboard design featuring the AMD E-Series APU,” said Adrian Thompson, Vice President of Marketing, SAPPHIRE. “With the AMD E-Series APU, our latest motherboard designs demonstrate enhanced performance and power-savings can be implemented in a cost effective PC platform.” Supporting Resources: AMD Fusion Partner Program Homepage AMD’s Fusion Blog AMD’s Work/Embedded Blog View AMD Fusion Demos at AMD Unprocessed YouTube Channel Cautionary StatementThis release contains forward-looking statements concerning, among other things, the timing of the planned introduction of AMD Fusion platforms and the features and performance of new product and technology releases which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as “would,” “may,” “expects,” “believes,” “plans,” “intends,” “projects,” and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this release are based on current beliefs, assumptions and expectations, speak only as of the date of these presentations and involve risks and uncertainties that could cause actual results to differ materially from current expectations. The material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: AMD will be unable to develop, launch and ramp new products and technologies in the volumes and mix required by the market; AMD’s third party wafer foundries will be unable to manufacture its products on a timely basis with acceptable quality, at acceptable manufacturing yields and using competitive technologies; AMD will be unable to maintain the level of investment in research and development that is required to remain competitive; demand for computers and consumer electronics products and, in turn, demand for AMD’s products will be lower than currently expected; customers will stop buying AMD’s products or materially reduce their demand for its products; there will be unexpected variations in market growth and demand for AMD’s products and technologies in light of the product mix that it may have available at any particular time or a decline in demand; or the effect of political or economic instability internationally on sales or production. Investors are urged to review in detail the risks and uncertainties in the company’s Securities and Exchange Commission filings, including but not limited to the Quarterly Report on Form 10-Q for the quarter ended September 25, 2010.