TSMC New Technologies For Integrated LED Drivers

Taiwan Semiconductor Manufacturing Company, Ltd. today unveiled modular BCD (Bipolar, CMOS DMOS) process
technologies targeting high voltage integrated LED driver devices.

The new BCD technologies feature a voltage spectrum running from 12
to 60 volts to support multiple LED applications including LCD flat
panel display backlighting, LED displays, general lighting and
automotive lighting. The technology portfolio spans process nodes from
0.6-micron to 0.18-micron with a number of digital core modular options
for varying digital control circuit gate densities. The CyberShuttleTM
prototyping service supports the 0.25-micron and 0.18-micron processes
for preliminary function verification.

The new processes provide a number of integration features that
reduce a system’s component counts. The robust high voltage DMOS
capability provides MOSFET switch integration to reduce the bill of
materials (BOM). The integrated passive component options include high
voltage bipolar, high voltage, high precision capacitors, high
resistance poly and Zener diodes to reduce external passive component
count and significantly reduce circuit board area.

The DMOS process supports foundry’s leading Rdson performance (i.e.; 72
mohm per mm2 at BV>80 volts for a specific 60V NLDMOS) and its high
current driving capability optimizes device sizes that enhance power
efficiency. A robust safe operating area (SOA) makes it ideal for both
power switch and driver design. Fine detailed characterization also
provides a useful reference to optimize the design budget for optimum
chip size.

On the CMOS side, a 5-volt capability supports analog Pulse
Width Modulation (PWM) controller design elements and the 2.5-volt and
1.8-volt logic cores are optional modules for higher-level digital
integration. In addition, logic compatible one-time programmable (OTP)
and multi-time programmable (MTP) memory options are available for
enhanced digital programming design.

“The new BCD technologies for LED drivers are very leading edge in
driving device integration. The associated PDKs feature highly accurate
SPICE models that really enhance the potential for easy single chip
design,” points out George Liu, Director, Industrial Business
Development. “In addition, mismatching models help optimize current
mismatching performance in multi-channel LED driver designs.”


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