CEVA, Inc., the leading licensor of silicon intellectual property
platform solutions and DSP cores, today announced that Samsung
Electronics Co., Ltd., has deployed CEVA DSP core technology in their
first generation commercial Long Term Evolution modem. The Kalmia
modem chipset supports download speed up to 100Mbps and upload speed of
50Mbps within the 20MHz frequency bandwidth. Samsung recently introduced
the first LTE dongle utilizing the modem and is now commercially
available in Stockholm, Sweden and Oslo, Norway.
"Our first commercially available LTE modem brings outstanding
dataspeeds and performance to a broad range of portable devices
including netbooks, eReaders, MIDs and more," said Kyung-Ho Kim, Vice
President of Samsung. "By leveraging CEVA’s DSP technology in our LTE
modem design, we ensure ultra-low power consumption, critical to the
successful adoption of LTE in these battery-powered devices."
"Samsung is the driving force behind the realization of a true
4G mobile broadband experience and we are proud to partner with them
for their LTE product line," said Gideon Wertheizer, CEO of CEVA. "Their
selection of our DSP core technology further substantiates our position
as the world’s leading provider of DSP technology to the wireless
industry."
CEVA’s industry-leading DSP cores power many of the world’s
leading cellular baseband handset solutions. The company’s broad
customer base includes Infineon, ST-Ericsson, Broadcom, Samsung,
Mediatek, Spreadtrum and VIA Telecom, among others. To date, more than
600 million CEVA-powered handsets have shipped. Addressing
next-generation 4G terminal and infrastructure markets, CEVA DSPs have
been specifically architected to overcome the stringent power
consumption, time-to-market and cost constraints associated with
developing high-performance 4G/LTE/WiMAX solutions. CEVA has multiple
licensees developing LTE handset and infrastructure solutions based on
CEVA DSP cores.
