CoolIT Systems Announces New System Builder Program
CoolIT Systems, leaders in advanced liquid cooling technology, announce today the launch of the CoolIT Systems System Builder Partner Program that will dedicate resources and focus on the System Builder market. The product offerings will be diversified from their already extensive portfolio with additional emphasis on custom cooling and control systems.
“For a number of years now, CoolIT Systems has been dedicated to delivering unique solutions to System Builders. 2011 marks a point where we will focus even more of our efforts in support of our System Builder partners”, says Barry Fairhurst, VP of Worldwide Sales, Marketing and Support. “By listening to our partners, we’ve redesigned our product and services offerings to create innovative custom solutions that help system integrators achieve their ideal product vision”.
To enhance the technical partnership with System Builders, CoolIT will be offering advanced thermal optimization services to their customers. The service will involve running the customers’ hardware configuration through systematic tests in an environmental chamber at highly controlled temperatures to determine the optimum airflow and thermal operating range, along with minimizing all of the system fan speeds for reduced acoustics. “For the first time system builders will have affordable access to services once only available tier 1 OEMs with dedicated engineering departments. The result is that system builders can have higher confidence in their builds and detailed analytics to use in their marketing initiatives. With this type of validation, we can help our partners to efficiently deliver quiet, reliable, high-performance products”, says Geoff Lyon, CEO and President of CoolIT Systems.
During the CES convention in Las Vegas, Nevada, from January 6 to 9, 2011, CoolIT will be holding individual meetings with system builders who wish to learn more about the program, or take a look at the new 2011 product line which will feature two new products with low-profile head units, and an advanced chassis control system for unmatched thermal management potential.